The purpose of the Program is to provide free bonds to employers as an incentive for the employer to hire at-risk applicants and to protect the employer against acts of dishonesty.
(Added by Ord. 272-07, File No. 070410, App. 11/26/2007)
var val = document.getElementById('citecontent').innerHTML;
art.dialog.defaults.title = window.location.href;
art.dialog.data('cite', val);
art.dialog.data('homeDemoPath', '/Scripts/plus/artDialog/');
art.dialog.open('/Scripts/plus/artDialog/citeiframe.html');